? semiconductor components industries, llc, 2002 august, 2002 rev. 3 1 publication order number: mmsz5221bt1/d mmsz5221bt1 series zener voltage regulators 500 mw sod123 surface mount three complete series of zener diodes are offered in the convenient, surface mount plastic sod123 package. these devices provide a convenient alternative to the leadless 34package style. specification features: ? 500 mw rating on fr4 or fr5 board ? wide zener reverse voltage range 2.4 v to 110 v ? package designed for optimal automated board assembly ? small package size for high density applications ? general purpose, medium current ? esd rating of class 3 (>16 kv) per human body model mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic case finish: corrosion resistant finish, easily solderable maximum case temperature for soldering purposes: 260 c for 10 seconds polarity: cathode indicated by polarity band flammability rating: ul94 v0 maximum ratings rating symbol max unit total power dissipation on fr5 board, (note 1) @ t l = 75 c derated above 75 c p d 500 6.7 mw mw/ c thermal resistance junction to ambient (note 2) r ja 340 c/w thermal resistance junction to lead (note 2) r jl 150 c/w junction and storage temperature range t j , t stg 55 to +150 c 1. fr5 = 3.5 x 1.5 inches, using the on minimum recommended footprint 2. thermal resistance measurement obtained via infrared scan method device package shipping ordering information sod123 case 425 style 1 1 cathode 2 anode mmsz52xxbt1 sod123 3000/tape & reel marking diagram see specific marking information in the device marking column of the electrical characteristics table on page 3 of this data sheet. device marking information xx = specific device code m = date code xx m 2the at1o suffix refers to an 8 mm, 7 inch reel. the at3o suffix refers to an 8 mm, 13 inch reel. 1 2 devices listed in bold, italic are on semiconductor preferred devices. preferred devices are recommended choices for future use and best overall value. aa aa aa mmsz52xxbt3 sod123 10,000/tape & reel http://onsemi.com
mmsz5221bt1 series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.95 v max. @ i f = 10 ma) symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage i f forward current v f forward voltage @ i f zener voltage regulator i f v i i r i zt v r v z v f
mmsz5221bt1 series http://onsemi.com 3 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma) zener voltage (notes 3 and 4) zener impedance (note 5) leakage current device v z (volts) @ i zt z zt @ i zt z zk @ i zk i r @ v r device device marking min nom max ma ma a volts mmsz5221bt1 c1 2.28 2.4 2.52 20 30 1200 0.25 100 1 mmsz5222bt1 c2 2.38 2.5 2.63 20 30 1250 0.25 100 1 mmsz5223bt1 c3 2.57 2.7 2.84 20 30 1300 0.25 75 1 mmsz5224bt1 c4 2.66 2.8 2.94 20 30 1400 0.25 75 1 mmsz5225bt1 c5 2.85 3.0 3.15 20 29 1600 0.25 50 1 mmsz5226bt1 d1 3.14 3.3 3.47 20 28 1600 0.25 25 1 mmsz5227bt1 d2 3.42 3.6 3.78 20 24 1700 0.25 15 1 mmsz5228bt1 d3 3.71 3.9 4.10 20 23 1900 0.25 10 1 mmsz5229bt1 d4 4.09 4.3 4.52 20 22 2000 0.25 5 1 mmsz5230bt1 d5 4.47 4.7 4.94 20 19 1900 0.25 5 2 mmsz5231bt1 e1 4.85 5.1 5.36 20 17 1600 0.25 5 2 mmsz5232bt1 e2 5.32 5.6 5.88 20 11 1600 0.25 5 3 mmsz5233bt1 e3 5.70 6.0 6.30 20 7 1600 0.25 5 3.5 mmsz5234bt1 e4 5.89 6.2 6.51 20 7 1000 0.25 5 4 mmsz5235bt1 e5 6.46 6.8 7.14 20 5 750 0.25 3 5 mmsz5236bt1 f1 7.13 7.5 7.88 20 6 500 0.25 3 6 mmsz5237bt1 f2 7.79 8.2 8.61 20 8 500 0.25 3 6.5 mmsz5238bt1 f3 8.27 8.7 9.14 20 8 600 0.25 3 6.5 mmsz5239bt1 f4 8.65 9.1 9.56 20 10 600 0.25 3 7 mmsz5240bt1 f5 9.50 10 10.50 20 17 600 0.25 3 8 mmsz5241bt1 h1 10.45 11 11.55 20 22 600 0.25 2 8.4 mmsz5242bt1 h2 11.40 12 12.60 20 30 600 0.25 1 9.1 mmsz5244bt1 h4 13.30 14 14.70 9.0 15 600 0.25 0.1 10 mmsz5245bt1 h5 14.25 15 15.75 8.5 16 600 0.25 0.1 11 mmsz5246bt1 j1 15.20 16 16.80 7.8 17 600 0.25 0.1 12 mmsz5247bt1 j2 16.15 17 17.85 7.4 19 600 0.25 0.1 13 mmsz5248bt1 j3 17.10 18 18.90 7.0 21 600 0.25 0.1 14 mmsz5250bt1 j5 19.00 20 21.00 6.2 25 600 0.25 0.1 15 mmsz5251bt1 k1 20.90 22 23.10 5.6 29 600 0.25 0.1 17 mmsz5252bt1 k2 22.80 24 25.20 5.2 33 600 0.25 0.1 18 mmsz5253bt1 k3 23.75 25 26.25 5.0 35 600 0.25 0.1 19 mmsz5254bt1 k4 25.65 27 28.35 4.6 41 600 0.25 0.1 21 mmsz5255bt1 k5 26.60 28 29.40 4.5 44 600 0.25 0.1 21 mmsz5256bt1 m1 28.50 30 31.50 4.2 49 600 0.25 0.1 23 mmsz5257bt1 m2 31.35 33 34.65 3.8 58 700 0.25 0.1 25 mmsz5258bt1 m3 34.20 36 37.80 3.4 70 700 0.25 0.1 27 mmsz5259bt1 m4 37.05 39 40.95 3.2 80 800 0.25 0.1 30 mmsz5260bt1 m5 40.85 43 45.15 3.0 93 900 0.25 0.1 33 mmsz5261bt1 n1 44.65 47 49.35 2.7 105 1000 0.25 0.1 36 mmsz5262bt1 n2 48.45 51 53.55 2.5 125 1100 0.25 0.1 39 mmsz5263bt1 n3 53.20 56 58.80 2.2 150 1300 0.25 0.1 43 mmsz5264bt1 n4 57.00 60 63.00 2.1 170 1400 0.25 0.1 46 mmsz5265bt1 n5 58.90 62 65.10 2.0 185 1400 0.25 0.1 47 mmsz5266bt1 p1 64.60 68 71.40 1.8 230 1600 0.25 0.1 52 mmsz5267bt1 p2 71.25 75 78.75 1.7 270 1700 0.25 0.1 56 mmsz5268bt1 p3 77.90 82 86.10 1.5 330 2000 0.25 0.1 62 mmsz5269bt1 p4 82.65 87 91.35 1.4 370 2200 0.25 0.1 68 mmsz5270bt1 p5 86.45 91 95.55 1.4 400 2300 0.25 0.1 69 mmsz5272bt1 r2 104.5 110 115.5 1.1 750 3000 0.25 0.1 84 3. the type numbers shown have a standard tolerance of 5% on the nominal zener voltage. 4. nominal zener voltage is measured with the device junction in thermal equilibrium at t l = 30 c 1 c 5. z zt and z zk are measured by dividing the ac voltage drop across the device by the ac current applied. the specified limits are for i z(ac) = 0.1 i z(dc) with the ac frequency = 1 khz.
mmsz5221bt1 series http://onsemi.com 4 typical characteristics v z , nominal zener voltage (v) 3 2 1 0 1 2 3 4 5 6 7 8 12 11 10 9 8 7 6 5 4 3 2 figure 1. temperature coefficients (temperature range 55 c to +150 c) typical t c values for mmsz5221bt1 series v z @ i zt 100 10 1 10 100 v z , nominal zener voltage (v) figure 2. temperature coefficients (temperature range 55 c to +150 c) v z @ i zt 1.2 1.0 0.8 0.6 0.4 0.2 0 150 125 100 75 50 25 0 t, temperature ( c) figure 3. steady state power derating p d versus t a p d versus t l 0.1 pw, pulse width (ms) figure 4. maximum nonrepetitive surge power 1 10 100 1000 1000 100 10 1 rectangular waveform, t a = 25 c 100 v z , nominal zener voltage figure 5. effect of zener voltage on zener impedance 10 1 1000 100 10 1 t j = 25 c i z(ac) = 0.1 i z(dc) f = 1 khz i z = 1 ma 5 ma 20 ma v f , forward voltage (v) figure 6. typical forward voltage 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 1000 100 10 1 75 v (mmsz5267bt1) 91 v (mmsz5270bt1) 150 c 75 c 25 c 0 c typical t c values for mmsz5221bt1 series vz , temperature coefficient (mv/ c) vz , temperature coefficient (mv/ c) p pk , peak surge power (watts) z zt , dynamic impedance ( ) i f , forward current (ma)
mmsz5221bt1 series http://onsemi.com 5 typical characteristics c, capacitance (pf) 100 v z , nominal zener voltage (v) figure 7. typical capacitance 1000 100 10 1 10 1 bias at 50% of v z nom t a = 25 c 0 v bias 1 v bias 12 v z , zener voltage (v) 100 10 1 0.1 0.01 10 8 6 4 2 0 t a = 25 c v z , zener voltage (v) 100 10 1 0.1 0.01 10 30 50 70 90 t a = 25 c 90 v z , nominal zener voltage (v) figure 8. typical leakage current 1000 100 10 1 0.1 0.01 0.001 0.0001 0.00001 80 70 60 50 40 30 20 10 0 +150 c +25 c 55 c figure 9. zener voltage versus zener current (v z up to 12 v) figure 10. zener voltage versus zener current (12 v to 91 v) i r , leakage current ( a) i z , zener current (ma) i z , zener current (ma)
mmsz5221bt1 series http://onsemi.com 6 information for using the sod-123 surface mount package minimum recommended footprints for surface mount applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. the minimum recommended footprint for the sod-123 is shown at the right. the sod-123 package can be used on existing surface mount boards which have been designed for the leadless 34 package style. the footprint compatibility makes conversion from leadless 34 to sod-123 straightforward. mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165 figure 11. minimum recommended footprint sod-123 power dissipation the power dissipation of the sod-123 is a function of the pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r ja , the thermal resistance from the device junction to ambient; and the operating temperature, t a . using the values provided on the data sheet for the sod-123 package, p d can be calculated as follows: p d = t j(max) t a r ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 0.37 watts. p d = 150 c 25 c 340 c/w = 0.37 watts the 340 c/w for the sod-123 package assumes using recommended footprint shown on fr-4 glass epoxy printed circuit board. another alternative is to use a ceramic substrate or an aluminum core board such as thermal clad ? . by using an aluminum core board material such as thermal clad, the power dissipation can be doubled using the same footprint. general soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
mmsz5221bt1 series http://onsemi.com 7 package dimensions sod123 case 42504 issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. cathode 2. anode aaaa aaaa b d k a c e j 1 2 h dim min max min max millimeters inches a 0.055 0.071 1.40 1.80 b 0.100 0.112 2.55 2.85 c 0.037 0.053 0.95 1.35 d 0.020 0.028 0.50 0.70 e 0.01 --- 0.25 --- h 0.000 0.004 0.00 0.10 j --- 0.006 --- 0.15 k 0.140 0.152 3.55 3.85 500 mw sod123 zener voltage regulators surface mounted
mmsz5221bt1 series http://onsemi.com 8 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and re asonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employ er. publication ordering information japan : on semiconductor, japan customer focus center 291 kamimeguro, meguroku, tokyo, japan 1530051 phone : 81357733850 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mmsz5221bt1/d thermal clad is a registered trademark of the bergquist company literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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